Equivalent to Fujimi FO L...

Equivalent to Fujimi FO Lapping Powder Physical properties and Chemical composition % item Size Specific gravity (g/cm3) chemical（%） Al2O3 SiO2 Fe2O3 TiO2 ZrO2 FO #800-#1200 ≥3.90 ≥45.0 ≤20.0 ≤0.5 ≤2.0 ≤33.0 #1500-3000 ≥3.90 ≥40.5 ≤25.0 ≤0.7 ≤2.0 ≤33.0 PSD(Particle Size Distribution) Size D0 D3 D50 D94 #800 ≤32.0 ≤27.0 11.3±0.9 ≥6.5 #1000 ≤27.0 ≤23.0 9.4±0.8 ≥5.0 #1200 ≤23.0 ≤20.0 7.1±0.7 ≥4.0 #1500 ≤19.0 ≤17.0 5.5±0.5 ≥3.0 #2000 ≤15.0 ≤14.0 4.5±0.4 ≥2.0 #3000 ≤12.0 ≤11.0 3.6±0.4 ≥1.5 Main Applications –Grinding and polishing of semiconductor wafers –Surface finishing of various optical glasses –Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals. –Surface finishing of piezoelectric materials Packing 10kgs pvc bags+pallet